#advanced-packaging

The federal government has announced a landmark $1.2 billion investment to establish a state-of-the-art advanced semiconductor packaging facility in Bromont, Quebec. This strategic move, led by a new consortium called Maple Advanced Packaging Inc., aims to secure Canada's domestic microchip supply chain and reduce reliance on foreign manufacturing. The initiative is a cornerstone of Canada's emerging national semiconductor strategy, designed to bolster economic security and position the country as a key player in the high-tech global economy, particularly in critical sectors like artificial intelligence, automotive, and telecommunications.

The federal government has announced a $2.5 billion investment aimed at establishing a domestic advanced semiconductor packaging industry. This strategic initiative seeks to reduce Canada's reliance on Asian supply chains for the critical final stage of chip manufacturing. The funding, part of a broader national strategy, will support facility construction, research and development, and talent acquisition. The move is a direct response to escalating geopolitical tensions and global efforts to onshore critical technology production, aiming to secure Canada's economic and national security in the highly competitive semiconductor landscape.